surface mount fuse (thin film chip fuse) document no tct - 060 s001a issued date 201 4/0 2/ 25 page 1 / 6 ta - i technology co., ltd rohs pb 1. scope this specification applies for the fuse series of surface mount fuse made by ta - i. 2. construction 3. type designation over coat ceramic substrate : al 2 o 3 termination cu / ni plating fuse element : cu/sn ct chip fuse 06 size 06 :0603(1608) v 5 rated voltage t pac k aging t: paper tape ( 4 k) v3:32v dc./32vac . v5:50 v dc./32vac . r 5 0 2 rated current r50:0. 5 0 a sn plating marking
surface mount fuse (thin film chip fuse) document no tct - 060 s001a issued date 201 4/0 2/ 25 page 2 / 6 ta - i technology co., ltd rohs pb 4. dimensions u nit : mm 5 . marking symbol for rating current symbol b c d e f k l m p n s t 3 u w y rating current(a) 0.2 0.25 0.315 0.4 0. 5 0.8 1 1.25 1.5 1.6 2 2.5 3 3.15 4 5 type ( size code) dimensions (mm) l w c d t c t 06 (0603) 1.6 5 0. 2 0.8 5 0. 2 0. 5 0. 2 0. 5 0. 2 0. 8 0. 2 0
surface mount fuse (thin film chip fuse) document no tct - 060 s001a issued date 201 4/0 2/ 25 page 3 / 6 ta - i technology co., ltd rohs pb 6. applications and ratings part designation marking rated current fusing time resistance * (m ) typical rated voltage breaking capacity ct 06v5 tr2 0 b 0.20a open within 2 min.at 200% rated current 3000 50 v dc / 32v ac 50a 50 v dc 32v ac ct06v5 tr 25 c 0.25a 1500 ct06v5 tr 315 d 0.315a 750 ct06v5 tr40 e 0.40a 496 ct0 6 v5 tr50 f 0.50a 343 ct0 6 v5 tr80 k 0.80a 142 ct0 6 v5 t1r0 l 1.00a 88 ct0 6 v5 t1r25 m 1.25a 63 ct0 6 v5 t1r50 p 1. 50 a 60 ct0 6 v5 t1r60 n 1.60a 56 ct0 6 v3t2r0 s 2.00a 34 32 v dc/ac 50a 32v dc/ac ct0 6 v3t2r50 t 2.50a 24.5 ct0 6 v3t3r00 3 3.00a 20 ct0 6 v3t3r15 u 3.15a 19 ct06v3t4r0 w 4.00a 1 3 ct0 6 v3t5r0 y 5.00 a 10 *resistance was measured with less than 10 % of rated current . 7.pre - arcing time rated current 1. 25 in (min) 2 .0 in (max) 10.0 in (max) 0.2~5a( type f ) 1 hrs 120 s 1 0 ms note: pre - arcing time at 10 times rated current according to the following types: type ff: less than 1m s type f: from 1m s to 10 m s type t: greater than 10m s to 100m s type tt: greater than 100m s to 1 000m s
surface mount fuse (thin film chip fuse) document no tct - 060 s001a issued date 201 4/0 2/ 25 page 4 / 6 ta - i technology co., ltd rohs pb 8 . reliability tests parameter requirement test method reference standard carrying capacity no fusing rated current ,4hr ul248 - 1 4 fusing time within 2 minute 200% of its rated current iec60127 - 4 - 9.2.1 breaking capacity without permanent arcing ignition bursting of fuse the rated voltage of the fuse and shall be maintained for 30 s after the fuse has operated. iec60127 - 1 iec60127 - 4 - 9.3.1 insulation resistance 0.1m and more measure with dc twice the rated voltage after breaking capacity iec60127 - 4 - 9.3.3 bending test no mechanical damages distance between holding points: 90mm, bending:3mm,1time ,30sec iec60115 - 1 - 4.33 resistance to solder heat O r O 20% 260 5 ,101second iec60028 - 2 - 58 solderability 95% coverage minimum 235 5 , 20. 2 second (solder : sn96.5 / ag3.0 / cu0.5) iec60 028 - 2 - 58 temperature rise t< 70 125% of its rated current, measure of surface temperature rise iec60127 - 4 - 9.7 resistance to dry heat O r O 20% 155 5 ,96 hrs iec60115 - 1 - 4.23.2 jis c5201 - 1 - 4.23.2 resistance to solvent no evident damages on protective coating and marking 15 s with a piece of cloth soaked in water and again for 15 s with a piece of cloth soaked in petroleum spirit. iec60127 - 1 - 6.2 thermal shock O r O 1 0% - 55 /+25 /+155 /+25 , 10 cycles mil - std 202 - 107g humidity O r O 20% 40 2 c/ 90~95 %rh,1000 hrs mil - std - 202g method 103b 9 . storage conditions : temperature: 5 ~35 ,humidity: 4 0 %~75% 10 . shelf life: 2 year s from manufacturing date
surface mount fuse (thin film chip fuse) document no tct - 060 s001a issued date 201 4/0 2/ 25 page 5 / 6 ta - i technology co., ltd rohs pb 1 1 . label f type ( pre - arcing time ) date code rating current t ype lot no: maker's name rating current customer code part designation date customer label 1 2 . recommended land patterns qty: 5000 pcs f r 5 0 200% t005f0005k 1005 c t 06v 5 t ta - i technology co.,l td lead free 06 03 50 vdc/32vac (t) f 0.5 a 200% 36h00823 - 00m ct06v 5 tr50 13.09.12
surface mount fuse (thin film chip fuse) document no tct - 060 s001a issued date 201 4/0 2/ 25 page 6 / 6 ta - i technology co., ltd rohs pb 1 3 . recommend ir C reflow profile : (solder : sn96.5 / ag3 / cu0.5) peak : 250 , 5 sec pre C heat zone : 150 to 180 , 90 30 sec soldering zone : 230 or higher , 30 10 sec 1 4 . ecn engineering change notice: the customer will be informed with ecn if there is significant modification on the characteristics an d materials described in approval sheet. 15. approvals iec60127 - 1 & iec60127 - 4 1 5 . manufacturing country & city : ta - i technology co., ltd. ( taiwan C tao yuan ) tait : no.26, lane 470, nan - shan rd., sec.2, lu - chu hsiang,taoyuan, taiwan tel: (+886) 3 - 324616 9 fax : (+886) 3 - 3246167 associated companies : (1) ta - i technology ( su zhou ) co., ltd. ( china C su zhou) no.675,luxiang north road,songling town, wujiang, china (215200) tel :(+86) 512 - 63457879 fax : (+86) 512 - 63457869 (2) ta - i technology electronic (dongguan ) co., ltd. ( china C dongguan ) chang xie road,shien - ma shiang changping town, dongguan city,guangdong tel : (+86) 769 - 8339 - 4790 ? 3 fax : (+86) 769 - 8339 - 4794 (3) tai ohm electronics ( m ) sdn. bhd. ( malaysia C penang ) plot 564 - d ,lorong perusah aan baru 2, kawasan perusahaan perai, 13600 perai, penang, malaysia. tel :(+60) 4 - 3900480 fax : (+60) 4 - 3901481 (4) p.t.tai electronic indonesia ( indonesia C jakarta ) blok t1 e,f, jl. jababeka iv cikarangindustrial estate bekasi, 17530 i ndonesia tel :(+62) 21 - 44820254 fax : (+62) 21 - 44820256 0 5 ? ?
|
